RTV-3110 Silicone Rubber Encapsulant With F Catalyst For Electronics Potting And Encapsulation, Room Temperature Cure, Easy To Mix And Pour, No Vacuum Deair Needed, Ideal For Simple Patterns And Varying Thickness

Single-Kit RTV-3110 Silicone Encapsulant for Electronics Potting
✔️ Room-temp cure, easy mix; 10:1 to 20:1 catalyst options

This two-part encapsulant kit covers electronics potting and encapsulation tasks. The 3110 base is a low-viscosity silicone rubber suited for reproducing simple patterns with no deep undercuts, and it cures to a firm, flexible material. When paired with the RTV-3000 F catalyst, it cures at room temperature in any thickness, making it ideal for quick potting in electronics and control assemblies where vacuum de-airing isn’t required.

✅ Color White
✅ Dielectric Constant at 100 Hz = 2.29
✅ Dielectric Constant at 100 kHz = 2.2
✅ Dielectric Strength = 434 volts per mil v/mil
✅ Dissipation Factor at 100 Hz = 0.01
✅ Dissipation Factor at 100 kHz = 0.001
✅ Durometer - Shore A = 45
✅ Dynamic Viscosity = 13000 Centipoise
✅ Elongation = 175%
✅ Temperature Range -55°C to 200°C
✅ Tensile Strength = 400 psi
✅ Thermal Conductivity = 0.000866 W/mK
✅ Specific Gravity @ 25°C = 1.14

💡 What is a silicone encapsulant used for in electronics?

It's a handy option for protecting boards and components during potting and simple patterns.

- Handy for moisture protection in electronics - Provides dielectric insulation and thermal stability - Room-temperature cure and easy pour for varying thickness - Great for simple patterns and quick prototyping