Go-To Component Packaging in Optoelectronics for Fiber Optic Systems and Photonics, a No-Nonsense, Down-To-Earth Guide to Packaging Tech, Thermal Management, Reliability, and Mechanical Engineering Essentials
UPC:
✔️ Single-copy, 300 pages, English edition, 2006 release
Component Packaging in Optoelectronics provides a focused overview for engineers and researchers working on fiber optic systems and photonics. It covers the history and current state of the art in optical communications and offers a toolkit spanning fundamental optics, fiber technology and interconnects, fundamentals of optoelectronic packaging, and optoelectronic chip fabrication. It ties photonic chip characteristics to packaging needs, with practical manufacturing insights. This 1st edition, 300-page English-language book was released on 15-12-2006.
✅ Author: Walter J. Shakespeare
✅ Edition: 1
✅ Pages: 300
✅ Language: English
✅ Release Date: 15-12-2006
✅ Subject: Component packaging in optoelectronics, fiber optic systems, photonics
💡 What is a practical guide to optoelectronic packaging used for in fiber optic systems?
This handy reference helps engineers understand how packaging choices impact performance.
- Packaging fundamentals, optics integration, and chip fabrication
- Thermal management, reliability, and manufacturing processes
- Fiber interconnects and photonic packaging guidelines