Pro Grade Lead-Free Solder Paste SAC0307 Sn99 Ag0.3 Cu0.7 For Precision Stencil Printing 217C Low Temp Melting T4 Fine Particle Size 20-38 Um For Smooth Joints And Minimal Heat Stress 100g
✔️ Sn99/Ag0.3/Cu0.7 alloy, melts at 217°C, 20-38μm, no-clean, 100g
Premium lead-free solder paste designed for precision stencil printing on PCBs. This SAC0307 alloy (Sn99/Ag0.3/Cu0.7) delivers strong joints and oxidation resistance, ideal for BGA, SMT, and PCB repairs in consumer electronics.
✅ Premium SAC0307 alloy (Sn99/Ag0.3/Cu0.7) delivers strong joints and oxidation resistance
✅ Low-temperature melting at 217°C minimizes heat stress on boards and components
✅ Fine particle size 20-38 μm ideal for precision stencil printing
✅ No-clean flux residue leaves non-conductive film; no post-clean required
✅ Suitable for BGA, SMT, and PCB repairs in consumer electronics
💡 What is solder paste used for in electronics assembly? This handy material helps create reliable joints by delivering controlled solder deposits during reflow.
- Provides precise solder deposition for fine pitch components
- Supports stencil printing for consistent joint quality
- Melts at moderate temperatures to reduce board stress
- Compatible with lead-free SAC alloys for durable connections