High Active Soldering Flux For Electronics And PCBs In A 10 Gram Syringe Tacky Paste For Fixing Oxidized Surfaces On Copper Pipes Works With Lead And Lead Free Alloys Ideal For FPGA BGA QFN QFP SOIC And SMD Pad Repair

High-Active Soldering Flux in a 10 g Syringe for PCBs
✔️ Active tacky flux for oxidized copper; lead and lead-free alloys.

This tacky flux is designed for soldering and repairing oxidized copper surfaces on PCBs and electronic assemblies. It supports FPGA, BGA, QFN, QFP, SOIC pads, SMD and DIP components during soldering and rework.

✅ ROM1 class soldering flux; residues may conduct electricity if not cleaned.
✅ Suitable for lead and lead-free alloys.
✅ Effective oxide removal and wetting on copper traces and PCB pads.
✅ Amber color; shelf life 2 years from date of manufacture.
✅ 10 g syringe packaging for precise application.

💡 What is a handy question to ask about using active solder flux for PCB repairs?

Active flux helps remove oxide and improve wetting on copper pads in electronics.

- Improves wetting on copper traces and pads
- Aids rework on boards with oxidized surfaces
- Works with lead and lead-free solders and RoHS compliant
- Clean residues after soldering with PCB cleaner to prevent conductivity