Dope Ultra Thin Blade BGA IC Chip Repair Toolkit For Cell Phone Motherboard And CPU Removal Glue Cleaner And Delicate Welding IC Dismantling Tools For Precision Rework

Ultra Thin Blade BGA IC Chip Repair Kit for Phones
✔️ Dual end stainless steel blades approx 170 mm long

This handy toolkit helps repair techs work on cell phone and computer motherboards by handling chip removal and glue cleanup tasks.

✅ Professional repair tool kit for smartphone computer logic board repair.
✅ Dual ends design each handle equipped with 2 blades for multi purpose use.
✅ Ultra thin springy blade high temperature resistance and not easy to deform.
✅ Designed for dismantling IC chip separating welding spot and cleaning glue.
✅ Stainless steel material with full length approx 170 mm.

💡 What tools are essential for BGA IC chip removal on logic boards? Stainless steel blade sets give reliable results during precision motherboard work. - Thin flexible tips slide under chips to limit board damage - Dual ended handles cut down on tool swaps mid job - Heat resistant build keeps blades steady through solder cleanup - Multi use design handles glue scraping and spot separation alike