Thermally Conductive Black Epoxy Encapsulant And Potting Compound, 2 Part Adhesive, 1 To 1 Mix, 2 Hour Working Time, Built Tough For Large Production Runs, Machinable, Superior Impact, Moisture, And Chemical Resistance

Black Thermally Conductive Epoxy Encapsulant Potting
✔️ 1 to 1 mix, 2 hr working time, single kit, thermal conductivity

Thermally conductive epoxy encapsulant and potting compound designed for electronics protection and heat management. This 100% solids system uses undiluted Bis F resin and aluminum oxide pigment to deliver solid mechanical properties with efficient heat transfer. Its black pigmentation provides effective thermal absorption and emission, while RoHS compliance makes it a safe choice for sensitive electronics.

✅ 2-part epoxy encapsulant and potting compound with 1:1 mix by volume
✅ 2-hour working time suitable for large production runs
✅ 100% solids Bis F resin with aluminum oxide pigment for strong thermal conductivity
✅ Pigmented black for effective thermal absorption and emission
✅ RoHS compliant and machinable for post-cure shaping

💡 What is epoxy encapsulant used for in electronics protection and thermal management?

- Handy epoxy encapsulant for electronics protection and moisture resistance
- Supports thermal management by dispersing heat through ceramic aluminum oxide fillers
- Great for large production runs due to strong potting and easy machinability
- Helpful for sealing and stabilizing assemblies in harsh environments
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