Lead Free Tin Solder Balls Set For PCB Reballing And Soldering, 6 Bottles With 0.2, 0.25, 0.3, 0.35, 0.4, 0.45 mm Sizes, Heat Resistant Universal Stencils For Chip Work, DIY Friendly Tin Balls For Fast, Clean, Reliable Connections

Precio habitual 59.99 Precio de oferta88.00Ahorras28.01
Product ID: 1139-7477
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Lead-Free Tin Solder Balls for PCB Reballing & Soldering
✔️ Six bottles of lead-free tin solder balls in 0.2-0.45 mm sizes

These tin solder balls are lead-free and designed for BGA reballing and general soldering on PCBs. They provide reliable connections when reballing semiconductor chips, circuit modules, and PCB boards, with heat-resistant stencils included for precise chip work.

✅ Lead-free tin material ensures stable, durable solder joints
✅ Ideal for BGA reballing and reliable PCB connections
✅ Each bottle contains approx 10,000 solder balls (six bottles total ~60,000)
✅ Sizes include 0.2, 0.25, 0.3, 0.35, 0.4, 0.45 mm for precise work
✅ Heat-resistant universal stencils included for clean chip work

💡 What is a tin solder ball set used for in PCB reballing and soldering applications?

- Provides precise, reliable solder joints during BGA reballing and repairs. - Handy for DIY electronics, prototypes, and small-batch repairs. - Works with heat-resistant stencils to keep chip placement accurate.