Aluminum Solder Paste Water Soluble Sn96.5 Ag3.5 T3 50g Jar For SMD And Heat Sinks Easy To Use Ideal For Soldering Aluminum To Aluminum Copper And Nickel Coated Aluminum Lead Free And RoHS Compliant

Aluminum Solder Paste with Water-Soluble Flux - 50g Jar
✔️ 50g jar, lead-free RoHS, water-soluble flux, Sn96.5/Ag3.5

This water-soluble aluminum solder paste is designed for bonding aluminum heat sinks to PCBs and for joining aluminum to copper or nickel-coated aluminum. It is lead-free and RoHS compliant for safe, reliable soldering in electronics manufacturing and repair.

✅ Alloy: Sn96.5/Ag3.5
✅ Flux: Synthetic water-soluble ROM1
✅ Particle Size: T3 (25-45 microns)
✅ Melting Point: 221 C (430 F)
✅ Metal Content: 75% by weight
✅ Size: 50 g jar
✅ Shelf Life: Refrigerated >12 months; unrefrigerated >6 months
✅ Stencil Life: >12 hours @ 20-50% RH, 22-28C; >4 hours @ 50-70% RH

💡 What is aluminum solder paste used for in electronics assembly? It’s handy for bonding aluminum heat sinks to PCBs and for joining aluminum to copper or nickel-coated aluminum. - It uses water-soluble ROM1 flux to enable clean post-solder wash - It bonds aluminum to aluminum, copper, and nickel-coated aluminum - It’s lead-free and RoHS compliant for safe electronics manufacturing