217 Degree Celsius High Temp Solder Paste For PCB Repair And BGA IC Soldering With Flux In Needle Tube 45g No-Fuss Easy Apply For Mobile Phone Motherboard Maintenance And Fine Pitch Electronics

High-Temp 217°C Solder Paste for PCB Repair & BGA 1 x 45g
✔️ 217°C melting point, oxidation protection, fine pitch print, 1x45g

This high-temp solder paste comes in a 45g needle tube and is designed for precise PCB repair and BGA soldering on mobile phone motherboards and other fine pitch electronics.

✅ 217°C melting point with resistance to cold slump, hot slump, and drying
✅ Oxidation protection via protective flux layer for reliable joints
✅ Fine pitch compatibility for BGAs, chip ICs, and precise components
✅ Low tin tombstone displacement improves joint integrity during soldering
✅ 45g needle-tube packaging enables controlled, exact application for repairs

💡 What is a handy use case for high-temp solder paste in electronics repair?

Handy for dense boards where precision matters. - It supports reliable joints on chip ICs and BGAs - It resists slump during reflow at 217°C - The 45g needle tube enables controlled application - Flux protects components from oxidation during soldering