100g RMA 218 No Clean Solder Flux Paste For BGA PCB Repair Rework Soldering High Viscosity Solder Flux For Sphere Or Pin Attachments On CGA CSP Packages

High-Viscosity No-Clean Flux Paste for BGA Rework 100g
✔️ 1 x 100 g no-clean flux paste for BGA/CGA/CSP rework

This high-viscosity no-clean flux paste is designed for BGA rework, sphere or pin attachments on BGA, CGA, and CSP packages. It's ideal for reballing and flip-chip operations, enabling secure solder ball adhesion with minimal cleanup.

✅ High-viscosity formula provides strong tack during sphere and pin attachment
✅ No-clean flux leaves minimal residues suitable for BGA/CGA/CSP boards
✅ 100 g container enables precise, controlled application
✅ Ideal for reballing and flip-chip assembly on common package types

💡 What is no-clean solder flux paste used for in BGA rework and why choose a high-viscosity formula?

Here's a handy, concise explanation for common questions about this product category.

- No-clean flux reduces post-solder cleanup because residues are designed to be non-corrosive. - High viscosity helps hold tiny solder balls in place during placement and reflow. - It's handy for reballing, sphere or pin attachments on BGA, CGA, and CSP packages. - Works well with precision tools and minimizes bridging in dense PCB layouts.