Universal BGA Reballing Solder Paste Stencil Kit For Phone IC Repair, Stainless Steel Mesh Template With Multi Size Holes 0.3, 0.35, 0.4, 0.5 Pitch, Different Spacings, Soldering Station Compatible

BGA Reballing Solder Stencil Kit for Phone IC Repair
✔️ Stainless steel mesh stencil with 0.3/0.35/0.4/0.5 pitch holes

This universal BGA reballing stencil is designed for precise tin deposition on ball-grid arrays used in modern smartphones, enabling reliable reballing for IC repair. It’s a handy tool for service centers and hobbyists working with mobile devices.

✅ Multi-size holes: 0.3/0.35/0.4/0.5 pitch and multiple spacings
✅ Premium stainless steel mesh for durability and precise tin deposition
✅ Precise positioning maintains ball shape under high temperatures
✅ Compact, portable stencil for easy transport in a repair kit

💡 What is a BGA reballing stencil used for in phone IC repair?

A handy tool for technicians doing BGA reballing on mobile ICs. It helps ensure precise tin deposition and reliable rework outcomes.

- precise hole patterns for 0.3-0.5 mm pitches - consistent tin transfer with stable ball geometry - reduces solder bridging and misalignment during reflow - works with common solder pastes and rework stations