Soldering Lugs Rework Pad Set For Phones And IC Pads No Fuss Easy Welding Point Repair For Touch BGA PCB And Fingerprint Modules Pro Grade Reinforced Pads With Fixed Pins Industrial Copper Foil Restores Pads Without Trace

Rework Pad Set for Phone PCBs with Fixed Pins - 1 Set
✔️ Pro-grade copper foil pads, fixed pins, 30μm copper foil

This soldering lug rework pad set is designed to restore missing solder joints on phone PCBs, BGA pads, and fingerprint modules. It’s used in repair labs and service centers for clean, trace-free pad restoration and reliable bonding.

✅ Reinforced pads with fixed pins prevent lift-off and ensure stable contact
✅ Industrial copper foil, 30μm thickness, for strong solder joints
✅ Excellent flatness reduces pseudo-soldering from uneven surfaces
✅ UV-curable solder mask ink adheres well to green oil and PCB
✅ Improves repair speed by eliminating looping jump wires and trace damage

💡 What is a rework pad set used for in electronics repair and how does it help restore PCB pads? This handy tool helps technicians restore damaged pads on phones and PCBs with clean, trace-free results. - Handy for repairing damaged solder pads on phones, ICs, and BGA boards - Improves solder joint reliability with fixed pins and uniform copper foil - Reduces trace damage by avoiding traditional looped jump wires - Compatible with UV-curable solder mask inks and green oil bonding