Sn99 Ag0.3 Cu0.7 Lead Free Solder Paste In A 5 Ml Syringe No Clean High Temperature Melt At 217 C With Smooth Flux For Electronics Assembly And Rework 11.2 Percent Flux Content
✔️ High-temp lead-free paste with smooth joints, 11.2% flux content
This high-temp, lead-free solder paste is designed for electronics assembly and rework. It delivers reliable wetting and smooth joints on heat sinks, LEDs, and densely populated PCBs, with minimal bridging after reflow.
✅ Sn: 99% / Ag: 0.3% / Cu: 0.7% composition
✅ Flux content: 11.2% for reliable wetting
✅ Melting point: 217°C (423°F)
✅ Package: 5 ml syringe, gross weight around 16 g
✅ Produces smooth, bridgeless joints with reduced solder balls
💡 What is the best lead-free solder paste for high-temperature electronics assembly and rework? A handy, general answer is a high-temp, lead-free solder paste with strong flux to ensure clean reflow. - high-temperature melting point for reliability - smooth wetting and minimal bridging for dense layouts - Sn99 Ag0.3 Cu0.7 composition reduces lead exposure - packaged in a 5 ml syringe for precise application