Sn63 Pb37 Tin Lead T4 Solder Paste No Clean 183C Melting Point 30g Paste 39g Total Weight Flux Content 10.5 Percent Solder For Surface Mount Easy Soldering Smooth Flow No Waste During Welding

Tin-Lead Sn63 Pb37 No-Clean Solder Paste SMT T4 30g in 39g
✔️ 30 g paste, 39 g total weight, flux 10.5%, no-clean, ready for reflow

Compact Sn63 Pb37 tin-lead solder paste designed for surface-mount work. It’s widely used in circuit boards, ICs, phones, TVs, and other household and industrial electronics.

✅ Paste content: Tin 63%, Pb 37% alloy, flux 10.5%
✅ Total weight: 39 g, net paste 30 g
✅ No-clean formula with strong viscosity and bright weld
✅ Smooth flow, no waste during welding
✅ Applications: circuit boards, ICs, phones, TVs, and industrial equipment

💡 What is tin-lead solder paste used for in electronics assembly?

Short intro: Handy for quick, precise SMT soldering with no-clean flux.

- Handy for surface-mount PCB assemblies and small components - Provides reliable wetting and bright, clean joints - Reduces post-welding cleanup due to no-clean flux - Suits standard reflow profiles for consumer electronics