SMT Solder Paste Cartridge 500g T5 15-25 Microns SAC305 No Clean Lead-Free RoHS Solder Paste For Surface Mount Assembly, Alloy Sn96.5 Ag3.0 Cu0.5 Melting Point 217-220C
✔️ Lead-free, no-clean flux, RoHS, 86% metal by weight
This lead-free solder paste cartridge is designed for surface mount assembly. Packaged as a 500g (6 oz) cartridge, it's used in reflow soldering to attach surface mount components to printed circuit boards, delivering reliable, clean joints with Sn96.5/Ag3.0/Cu0.5 alloy.
✅ 500g (6 oz) cartridge, lead-free no-clean solder paste
✅ Alloy Sn96.5/Ag3.0/Cu0.5 (SAC305) with T5 15-25 µm particles
✅ Melting point 217-220°C (423-428°F)
✅ Synthetic No-Clean flux, RoHS compliant; 86% metal by weight
✅ Shelf life: refrigerated >6 months; unrefrigerated >2 months
✅ Stencil life: >8 h at 20-50% RH, 22-28°C; >4 h at 50-70% RH
💡 What is solder paste used for in surface mount assembly? Solder paste is handy for attaching components and enabling reliable reflow joints. - Provides tack to hold components in place during placement - Controls solder volume for consistent joints during reflow - Works with Sn96.5/Ag3.0/Cu0.5 alloys and no-clean flux
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