Pro Reflow Oven For SMD SMT BGA Rework, Infrared Heater With Hot Air Circulation, 800W/1500W Dual Power, Microcomputer Controlled Soldering Station, PCB Board Soldering Machine, Fast Even Heating, T962

T962 Reflow Oven for SMD/BGA with IR Air - Single Unit
✔️ 800W/1500W dual power, 180x235 mm (7.1x9.2 in) or 300x320 mm (11.8x12.6 in) area, auto control

The T962 reflow oven is a compact infrared and hot-air soldering system designed for surface-mount device work like chips and BGA. It's ideal for electronics labs and small workshops for quick rework of boards with precise, repeatable heating to prevent warping and tombstoning.

✅ Power: 800W/1500W dual power
✅ Soldering area: 180x235 mm (7.1x9.2 in) or 300x320 mm (11.8x12.6 in)
✅ Temperature range: 0-280°C
✅ Cycle time: 1-8 min; Duty cycle 100%

💡 What is a reflow oven used for in PCB soldering and why choose infrared and hot air models?

For soldering and rework this handy tool focuses heat delivery and temperature control.

- Precise temperature control for consistent solder joints - Infrared heating paired with hot air for even heat distribution - Automated temperature curves and cooling cycles reduce errors - Works across various PCB sizes and components like SOP, QFP, and BGAs