Pro Grade Soldering Lugs Rework Pad For Mobile Phone IC Spot Welding And BGA PCB Pad Repair With Copper Wire And Plate Solder Piece Rework For Fast Board Maintenance And Flying Wire Patching 4.8 By 5.8 Cm
✔️ Precise pad rework surface; 1 piece pad covers 100 solder points
Compact, high-precision rework pad designed for accurate mobile phone IC pad spot welding on BGA-PCB boards. It stabilizes tiny pads in tight board areas, speeding up repairs and patching tasks on smartphones and similar devices.
✅ Stable copper wire + PC plastic plate structure ensures even welding surface.
✅ Reinforced retaining pins keep the pad in place during soldering.
✅ Easy peel-and-apply protective layer for quick, clean placement.
✅ Each pad covers 100 solder points of various shapes, boosting efficiency.
✅ Size: approx. 4.8x5.8 cm (48x58 mm) and 2x2.3 inches; 1 Pc.
💡 What is a pad rework pad used for in electronics repair and why should I choose copper wire rework pads?
This handy tool keeps tiny IC pads aligned and protects BGA-PCB surfaces during soldering and patch work.
- handy surface for precise IC pad soldering on crowded boards - reduces risk of pad damage and improves alignment during rework - compatible with copper wire and plate rework methods for fast, clean repairs