Pro Grade Middle Layer BGA Reballing Stencil For iPhone 12 And 12 Pro, 0.10mm Tin Planting Net Soldering Mesh, Direct Heating Steel Mesh Template, Magnetic Positioning For Precise Motherboard Repair Tools

Middle Layer BGA Reballing Stencil for iPhone 12/12 Pro
✔️ 0.10mm steel mesh, strong magnetic positioning, precise alignment, 1PC

The BGA reballing stencil is designed for the middle layer of the iPhone 12/12 Pro motherboard. This handy tool is used in professional repair setups to perform accurate tin planting and soldering net tasks on iPhone 12 series devices.

✅ Material: high quality steel
✅ Strong magnetic attraction for quick, accurate placement
✅ 0.10mm tin planting net / soldering mesh for iPhone 12/12 Pro middle layer
✅ Direct heating steel mesh template for reliable reballing
✅ Magnetic positioning for precise motherboard repair tools
✅ Package includes 1PC

💡 What is a BGA reballing stencil used for in iPhone 12/12 Pro motherboard repair?

This handy tool helps technicians restore solder joints on BGA pads with precision. - For precise tin planting on iPhone 12/12 Pro middle layer using 0.10mm balls - Magnetic positioning helps alignment during BGA reballing on iPhone 12/12 Pro - Direct heating steel mesh template supports consistent soldering net results - Ideal for professional repair workflows and motherboard middle-layer work✝️