Pro Grade Magnetic BGA Reballing Stencil Kit For Notebook SR2NH CPU IC Chips Solder Ball Tin Plating Template Heating Direct Reballing Steel Mesh Repair Tools 0.15mm Top Notch Quality
✔️ 0.15mm metal stencil, heated by hot air, single-unit pack
This magnetic BGA reballing stencil kit is designed for notebook SR2NH CPU IC chips to facilitate solder ball tin planting, heating, and direct reballing on a steel mesh template. Used in electronics repair shops and labs for precise BGA rework.
✅ 0.15 mm stencil thickness for precise ball placement
✅ All-steel construction with Japan-made materials for durability
✅ Heated by hot air for direct reballing without deformation
✅ Compatible with NOTEBOOK SR2NH CPU IC chips solder ball tin planting
💡 What is a BGA reballing stencil kit used for in notebook repair?
This handy tool guides solder balls and supports precise BGA rework on SR2NH notebooks.
- Accurate alignment of solder balls during reballing for SR2NH CPU ICs
- Enables tin plating and direct heating without deforming stencil
- Reusable steel mesh construction ensures long-lasting performance