Pro Grade Magnetic BGA Reballing Stencil Kit For IPhone A13 CPU Bottom Layer Solder Tin Planting Template Direct Heat Net Reballing Steel Mesh Repair Tools 010mm

Premium Magnetic BGA Reballing Kit for iPhone A13 - 1pc
✔️ 0.10mm thickness, magnetic template, heat resistant steel

This magnetic reballing stencil kit is designed for iPhone A13 CPU bottom-layer solder tin planting and direct-heat welding. It’s an essential tool for professional repair shops needing precise tin deposition during BGA reballing.

✅ 0.10mm stencil thickness for precise tin planting on iPhone A13 CPU pads
✅ Magnetic template for quick alignment during reballing
✅ Heat-resistant steel mesh withstands direct heat soldering
✅ All steel materials are made in Japan for durability
✅ Pack: 1 piece

💡 What is a BGA reballing stencil kit used for in iPhone repair?
A handy explanation: It guides tin deposition on the CPU bottom-layer pads during reballing for reliable solder joints.
- BGA reballing stencil guides solder ball placement on iPhone A13 CPU pads
- 0.10mm stencil thickness enables precise tin deposition with direct heat
- Magnetic template helps quick alignment during repair work

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