Pro Grade Automatic Infrared Reflow Soldering Oven For PCB Chips And Aluminum Substrates 1500W T962A Infrared IC Heater With Auto Preheat Soak Reflow Cool Down Large 11.81 X 12.59 Inch Welding Area For Easy Soldering

Single Unit Auto Infrared Reflow Oven for PCB & Aluminum
✔️ 1500W auto preheat, soak, reflow, cooldown; 11.81×12.59 in area

This auto infrared reflow oven uses microcomputer control to automate preheat, soak, reflow, and cooldown for precise soldering on PCB chips and aluminum substrates. The large welding area measures 11.81 × 12.59 inches (300 × 320 mm), enabling efficient soldering on prototypes and small production runs.

✅ 1500W infrared IC heater with microcomputer control
✅ Large welding area 11.81 × 12.59 inches (300 × 320 mm)
✅ Temperature range 0℃-280℃ with eight selectable curves
✅ Vent design with Φ110mm exhaust port (pipe not included)

💡 What is an infrared reflow soldering oven used for in electronics manufacturing?

It provides controlled infrared heat to form reliable solder joints on boards and metal substrates.

- efficient for PCBs and aluminum substrates in prototyping and small runs
- handy for controlled infrared heating with eight curves and 0℃-280℃ range
- helps ensure repeatable, high-quality solder joints in compact lab setups
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