Magnetic BGA Reballing Stencil Kit For Notebook W614TB37 CPU ICs Solder Ball Template With Steel Mesh Heating Direct Reball Tool 0.15mm Pro Grade Reballing Set
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$53.95
Sale price$137.00you save $83.05
Magnetic BGA Reballing Stencil Kit for W614TB37 Notebook
✔️ 0.15mm steel mesh, direct heating, pro-grade reballing set (1pc)
✅ Steel mesh construction resists deformation under heat
✅ Compatible with W614TB37 notebook CPU IC solder ball tin planting
✅ Supports direct heating with hot air rework stations
✔️ 0.15mm steel mesh, direct heating, pro-grade reballing set (1pc)
Premium magnetic BGA reballing stencil kit designed for notebook CPU IC solder ball tin planting and direct steel-mesh heating. Ideal for repair shops and hobbyists needing precise stencil alignment during reballing.
✅ 0.15mm aperture precision for BGA reballing✅ Steel mesh construction resists deformation under heat
✅ Compatible with W614TB37 notebook CPU IC solder ball tin planting
✅ Supports direct heating with hot air rework stations
💡 What is a BGA reballing stencil used for?
A handy intro sentence explaining its role in repair and rework processes.- High-precision stencil for accurate solder ball placement on BGA ICs
- Works with hot air rework stations for direct heating and reballing
- 0.15mm aperture matches fine-pitch notebook CPUs like W614TB37
- Sturdy steel mesh construction supports repeated use in service shops