Magnetic BGA Reballing Stencil Kit For iPhone A12 Upper RAM Layer Repair, 0.12mm Steel Mesh Template For Precise Tin Soldering, Heat Safe And Deformation Resistant, Pro Grade Reballing Tool Set For DIY And Repair Pros
✔️ 0.12mm steel mesh stencil, heat resistant for hot air rework
This magnetic BGA reballing stencil kit is designed for iPhone A12 upper RAM layer soldering. It’s a precise steel mesh template used in repair shops and DIY workbenches for tin deposition and heating-based reballing.
✅ 0.12mm steel mesh thickness for precise tin deposition
✅ Made in Japan from all-steel materials
✅ Heat safe and deformation resistant under hot air rework
✅ Magnetic stencil for quick alignment on iPhone A12 RAM layer
✅ Includes 1 piece per kit
💡 What is a BGA reballing stencil kit used for in iPhone A12 RAM repairs? A handy tool for precise tin deposition and RAM reballing in electronics work.
- Handy for BGA reballing on iPhone A12 RAM upper layer
- Supports precise tin deposition on 0.12mm steel mesh template
- Compatible with hot air rework and direct heating templates