Magnetic BGA Reballing Stencil Kit For iPhone 7 7P 8 8P Baseband IC Solder Tin Planting Template Heating Direct Reballing Steel Mesh Repair Tools 0.10mm Ideal For Pro Techs And Serious DIY Soldering

Precision Magnetic BGA Reballing Kit for iPhone 7 8 Baseband IC Repair
✔️ 0.10mm thickness for Intel baseband IC solder tin planting 1pc set

This handy magnetic stencil kit makes solder planting on baseband chips straightforward during iPhone motherboard fixes in professional shops or home setups.

✅ 0.10mm steel mesh for accurate tin deposition
✅ Magnetic hold keeps stencil stable on the board
✅ Fits iPhone 7 7P 8 8P Intel baseband ICs
✅ Direct heating reballing design speeds repairs

💡 What is a reballing stencil used for in phone repairs? This tool helps restore solder balls on chipsets after they are removed during fixes. - Handy for aligning tiny solder deposits on baseband parts - Supports clean heating direct methods without extra jigs - Works well for pros handling repeated motherboard jobs - Keeps the process consistent across similar iPhone models

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