Low-Temp Lead-Free Solder Paste For Precision Soldering With Tin-Bismuth Alloy, Melts At 138 Celsius To Protect PCBs And Components, Very Fine T4 Particles From 20 To 38 Micrometers For Exact Stencil Printing And Small Component Joints, No Clean Flux
✔️ Melts at 138°C; Sn42/Bi58 alloy; 20-38 μm T4 particles; 20g no-clean
This low-temp lead-free solder paste uses a tin-bismuth Sn42/Bi58 alloy designed for precision soldering on PCBs. With a melting point around 138°C, it protects delicate components and boards during reflow or manual soldering. The small 20-38 μm T4 particles enable fine stencil printing and reliable joints for tiny components such as BGA and SMT pads. The flux is no-clean, leaves minimal residue, and requires no post-cleaning, making it ideal for repair work and high-density assemblies. Pack size: 20 g.
✅ Alloy: Sn42/Bi58 lead-free with strong joints
✅ Melting point: approx 138°C to protect PCBs and components
✅ Particle size: 20-38 μm (T4) for fine stencil printing
✅ Flux: no-clean residue, no post-cleaning required
✅ Pack size: 20 g paste for small projects
💡 What is a low-temperature lead-free solder paste used for in precision electronics assembly?
A handy paste for protecting heat-sensitive boards and enabling precise solder joints.
- Protects components by melting at a low temperature - Enables precise stencil printing for tiny joints - Provides strong, oxidation-resistant connections with Sn42/Bi58 - No-clean flux simplifies workflow with minimal cleanup