Lead Free Solder Paste Sn64.7 Bi35 Ag0.3 20G No Clean Medium Temp For SMD SMT IC LED PCB Repairs, Melts At 151C And 179C, Flux Loaded For No Fuss Bonding And Solid Joints
✔️ Flux-loaded no-clean paste for SMT bonding, 20g, melts 151/179°C
This lead-free solder paste is designed for repairing and reworking SMT components on PCBs and LED assemblies. It features flux-loaded, no-clean chemistry and a medium-temp melting range to simplify hand soldering and rework tasks.
✅ Alloy composition: Sn 64.7%, Bi 35%, Ag 0.3% for lead-free reliability
✅ Melting range: 151°C and 179°C for controlled reflow
✅ Weight: 20g per syringe; compact and easy to store
✅ Flux-loaded no-clean formulation reduces post-bond cleanup
✅ Syringe design includes plunger, two plastic heads, and red/white needles
✅ Suitable for SMT/IC and LED PCB repairs with small pads
💡 What is the best hand-friendly lead-free solder paste for SMD repair and rework? This handy paste is designed for quick, reliable bonds on tiny components. - Hand-friendly flow at controlled temps for SMT ICs and LED boards - Flux-loaded formula reduces need for extra flux during work - No-clean residue minimizes post-rework cleanup - Suitable for PCB repairs and LED module rework