Lead Free No Clean Solder Paste Sn42 Bi57.6 Ag0.4 Low Temperature Melt 138C 281F For Surface Mount Rework SMD Syringe 5cc 15g T3 25 to 45 Microns 87 Percent Metal Content

Low-Temp Lead-Free Solder Paste for SMD Rework 5cc Syringe
✔️ Sn42/Bi57.6/Ag0.4, 87% metal by weight, T3 25-45 μm, 5cc syringe

This lead-free solder paste is RoHS compliant and no-clean, designed for surface mount device rework. Packaged in a 5cc syringe, it supports precise, clean joints with minimal residue.

✅ Lead-free RoHS compliant no-clean solder paste
✅ Low-temperature eutectic Sn42/Bi57.6/Ag0.4 at 138°C (281°F)
✅ 87% metal by weight content for strong joints
✅ Particle size T3 (25-45 μm) for fine-pitch work
✅ 5cc/15g syringe packaging, white color
✅ Suitable for surface mount rework and routine reflow

💡 What is a low-temperature lead-free solder paste used for in SMD rework? This handy paste helps solder tiny components without overheating the board.
- handy for SMD rework and reflow with minimal heat exposure
- lead-free no-clean formulation suited for fine-pitch parts
- eutectic Sn42/Bi57.6/Ag0.4 at 138°C facilitates reliable joints
- reduces flux residue and makes pad cleanup easier