Lead-Based Solder Paste Sn63 Pb37 30G With No Clean Flux 10cc For Electronic Soldering Easy Flow Pro-Grade Pushing Type Design Medium Temperature 183 C Melting Point Ideal For Chip BGA SMD Repairs

Lead-Based Solder Paste Sn63 Pb37 with No-Clean Flux 30g
✔️ Pushing-type design delivers smooth flow, 30g paste, 10cc flux

Lead-based solder paste with Sn63 Pb37 ratio and no-clean flux is widely used in electronics repair for PCB assemblies, BGA and SMD work.

✅ Solder content: Tin 63%, Lead 37%
✅ Flux: No-clean, 10.8%
✅ Particle size: 15-25 microns (T5)
✅ Melting point: 183°C (361°F)
✅ Pushing-type design reduces welding waste
✅ Pack: 30 g solder paste with 10 cc flux

💡 What is a solder paste with no-clean flux best for electronics repairs and how does it work?

It’s handy for quick, reliable joints on dense PCBs where cleaning is a pain.

- High tin-lead Sn63 Pb37 ensures reliable wetting on copper traces
- No-clean flux minimizes post-solder cleanup and residue risk
- Melts near 183°C to fit standard reflow profiles
- Works well with BGA and SMD components for handy repairs