Hot Temp Lead Free Solder Paste Sn99 Ag0.3 Cu0.7 For Electronics No Clean 217C Melting Point Solder Paste Syringe Pack 5ML Four Pack Smooth Even Joints
✔️ Sn99 Ag0.3 Cu0.7, 217°C melt, No-Clean, 4x5ml syringes
Lead-free solder paste designed for electronics assembly and rework, packaged as four 5 ml syringes (approximately 16 g each), delivering precise deposits for PCBs, heat sinks, LED modules, and high-frequency devices.
✅ Sn99 Ag0.3 Cu0.7 alloy with Flux 11.2% ensures strong joints
✅ Melting point 217°C (423°F) for reliable high-temp soldering
✅ Lead-free, no-clean flux yields smooth joints with minimal bridging
✅ Each syringe is 5 ml (~16 g); pack of four for multi-site work
✅ Ideal for heat sink modules, LED soldering, PCB BGA/SMT rework
✅ Smooth, even joints and no solder balls after reflow
💡 What is solder paste used for in electronics assembly? Solder paste is handy for precise deposition and rework on dense PCB layouts. - Precise deposition with syringe and stencil - Handy for component replacements and rework - Helps form reliable solder joints on BGA, SMT, and LED modules - Reduces cleanup time with no-clean flux