Hexagonal Boron Nitride Powder For High Thermal Conductivity And Low Expansion Micro And Nano Particle Forms 100 Gram Pack Pro Grade For Electronics And Ceramics With Spherical BN Particles In Sizes 1 To 300 Micron And 100 To 500 Nanometer

Premium hexagonal boron nitride powder for high thermal
✔️ 100 g pack, micron and nm particle sizes, ideal for electronics

Hexagonal boron nitride powder (BN) is a pro-grade additive offered in micro and nano particle forms, engineered for high thermal conductivity and low expansion. It’s widely used in electronics cooling, ceramic composites, and high-temperature coatings to improve heat transfer and dimensional stability.

✅ Includes particle sizes: 1 µm, 10 µm, 25 µm, 40 µm, 150 µm, 300 µm, 100 nm, 500 nm
✅ High heat resistance up to 3000°C sublimation; stable at 1800°C and above
✅ High thermal conductivity up to 33 W/m·K in hot-pressed forms
✅ Very low thermal expansion (~2×10^-6) for excellent dimensional stability
✅ Excellent electrical insulation with low dielectric loss and high breakdown strength
✅ Good chemical compatibility with metals, ceramics, glass, and oxidizing environments
✅ High-purity BN (impurities <10 ppm, boron ≥43.6%) and machinability at low Mohs hardness 2

💡 What is hexagonal boron nitride powder used for in electronics and ceramics?

- Handy filler in ceramic matrices to boost thermal conductivity
- Used as dry lubricant and high-temperature coatings for moving parts
- Insulating filler in electrical components and heat sinks for reliable performance