Five Bottle Leaded BGA Solder Balls Set With Twenty Five Thousand Per Bottle Sn63 Pb37 Reballing Tin Balls For GPU And CPU IC Chips Soldering Rework And Circuit Board Repair Pro Grade Quality Durable And Ready To Use

Five-Bottle Sn63 Pb37 BGA Solder Balls for Rework
✔️ Five bottles, 25k each; diameters 0.4-0.76mm; Sn63 Pb37

These leaded BGA solder balls are designed for reballing GPU and CPU ICs, as well as other surface-mount boards. They provide reliable connections when replacing damaged solder balls on chips and PCBs.

✅ Sn63 Pb37 alloy
✅ Diameters: 0.4mm, 0.45mm, 0.5mm, 0.6mm, 0.76mm
✅ 25,000 pcs per bottle; 5 bottles total
✅ Soldering temperatures: lead-free 245-260°C; leaded 180-205°C
✅ Pack: 5 bottles, 125,000 pcs total

💡 What is a BGA solder ball set used for in electronics repair and reballing?

These tiny Sn63 Pb37 balls are used to reball BGA packages and restore solder joints on GPUs, CPUs, and other PCB assemblies. - Handy for reballing small ICs on GPUs and CPUs - Helps fix damaged joints on PCBs and chip packages - Works with Sn63 Pb37 alloy for reliable joints