BGA Reballing Stencil For IPhone 13 Pro Max Mini CPU IC Solder Template Tin Planting Net Heating Direct Steel Mesh Repair Tool High Precision Magnetic Positioning For Easy Reballing And IC Rework

BGA Reballing Stencil for iPhone 13 Pro/Max/Mini - 1 PC
✔️ Magnetic positioning, heat-resistant steel stencil for reballing

This BGA reballing stencil is a high-quality steel template designed for iPhone 13 Pro, Pro Max, and Mini devices. It enables precise tin planting on A15 CPU BGA pads and supports easy IC rework in professional phone repair shops.

✅ Material: High-quality steel with strong magnetic attraction and precision positioning
✅ Tin planting net steel mesh designed for precise BGA reballing of iPhone 13 series A15 CPU
✅ Heat tolerance for hot air rework without deformation
✅ Pack size: 1 PC; includes one stencil for phone repair tools

💡 What is a BGA reballing stencil used for in phone repair? This handy tool helps restore solder connections on tiny BGA pads during IC rework.
- A BGA stencil guides tin deposition on iPhone 13 Pro/Max/Mini A15 CPU pads for reliable reballing
- Magnetic positioning enables quick, repeatable alignment during hot air rework
- Built from heat-resistant steel for long life in busy repair shops

✝️