1.5mm Lead Free Rosin Flux Core Solder Wire 0.06 Inch Diameter 50g 1.76oz Sn99 Ag0.3 Cu0.7 For Quick Slick Drag Soldering On MCU IC DIP Components Easy Flux Soldering For Electric Projects
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0.06 in Rosin Core Solder Wire for Drag Soldering on MCU
✔️ Diameter 0.06 in (1.5 mm); Sn99 Ag0.3 Cu0.7; 50 g spool
✅ Sn99 Ag0.3 Cu0.7 alloy provides strong, conductive joints with 0.3% silver
✅ Rosin core flux around 2.5% improves flow and wetting
✅ Melting point near 419°F (215°C), compatible with common tools
✅ Pack: 1 spool of 50 g (1.76 oz) for DIY projects
This rosin core solder wire is designed for fast, clean joints on MCU boards, ICs, and DIP components. Its flux helps smooth flow and reliable wetting, making it handy for quick repairs, DIY electronics, and prototyping.
✅ 0.06 in (1.5 mm) diameter for wide soldering reach✅ Sn99 Ag0.3 Cu0.7 alloy provides strong, conductive joints with 0.3% silver
✅ Rosin core flux around 2.5% improves flow and wetting
✅ Melting point near 419°F (215°C), compatible with common tools
✅ Pack: 1 spool of 50 g (1.76 oz) for DIY projects
💡 What is rosin core solder wire used for in small electronics work and why choose a 0.06 in diameter? Rosin core flux helps wetting and flow for clean joints in tight spaces. This handy guide explains the basics for common DIY electronics tasks.
- Handy for hand soldering on MCU boards, ICs, and connectors - 0.06 in diameter balances control and throughput on fine pitch parts - Sn99 Ag0.3 Cu0.7 alloy provides solid, conductive joints - Rosin flux (~2.5%) improves wetting and reduces solder bridging
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