Pro Grade Solder Paste In Jar 250g T3 SAC305 No Clean Flux Lead Free RoHS SMT Sn96.5Ag3Cu0.5 25 To 45 Microns Melt Point 217 To 220C 88.5 Percent Metal By Weight
✔️ 250 g jar, SAC305, 88.5% metal, 25-45 μm particles, no-clean flux
Lead-free solder paste in a 250 g jar intended for surface mount technology. This SAC305 no-clean paste uses a synthetic flux and delivers RoHS-compliant solder joints on PCB assemblies, including fine-pitch components.
✅ Alloy: Sn96.5Ag3Cu0.5; Flux: Synthetic No-Clean
✅ Metal content: 88.5% by weight; Particle size: T3 (25-45 μm)
✅ Melting point: 217-220°C; Pack size: 250 g jar
✅ Shelf life: Refrigerated >6 months; Unrefrigerated >2 months
✅ Stencil life: >8 hours at 20-50% RH; Cleaning: IPA or automated stencil systems
💡 What is solder paste used for in PCB assembly and why choose lead-free SAC305 paste? This handy paste supports reliable soldering in modern SMT workflows. - Handy for accurate deposition on surface mount boards - Supports reliable wetting and joint formation during reflow - RoHS-compliant, lead-free option reduces environmental impact - Compatible with stencil printing and automated stencil cleaning