Pro Grade Mechanic Solder Paste XG-50 Sn63 Pb37 Flux For Mobile Phone PCB Repair Solder Iron Station Ready Paste 25-48μm Particle Size 35-38g Bottle Easy To Apply For Quick Reliable PCB Fixes

High-Grade Solder Paste XG-50 for Mobile PCB Repair
✔️ Sn63/Pb37 alloy, 25-48 μm particles; 35-38 g bottle

Compact solder paste designed for mobile phone PCB repairs and rework on surface-mounted parts. It’s compatible with standard solder iron station workflows and provides reliable tack for precise pad deposition.

✅ Particle size: 25-48 μm for smooth paste deposition
✅ Alloy: Sn63/Pb37 for reliable solder joints
✅ Weight: 35-38 g per bottle
✅ Storage: 0-10°C to maintain flux activity
✅ Application: suitable for BGA and phone motherboard repair

💡 What is a solder paste flux used for in electronics repair?

- Handy for improving wetting and joint reliability on mobile PCB assemblies - Useful for BGA rework and fine-pitch pad handling - Reduces oxidation and prevents solder bridges during reflow - Works with Sn63/Pb37 alloys and flux pastes for quick, reliable fixes