Low Viscosity Halogen-Free Liquid Flux For BGA Rework And Reballing Reflow Ready 10g Pro Grade For VGA GPU Repairs And Precise Pad Coverage Solder Ball Protection And Smooth Reflow
✔️ 10g syringe with 1.6mm tip; lead-free, easy cleanup, EU-made
CS-FLUX is a low-viscosity, halogen-free liquid flux designed for BGA rework, reballing and reflow. When heated to about 150°C, it liquefies to fill the tiny gap between the BGA balls and the PCB, protecting pads and solder balls from oxidation during reflow or component removal. It is no-clean and won't corrode if left uncleaned, and can be easily cleaned with alcohol if needed. Its sticky consistency helps keep solder balls in place during reballing, and it minimizes fumes by being lead-free and halogen-free. Pack includes one 10 g syringe and a 1.6 mm application tip. Made in Greece (EU).
✅ Liquid flux coats the gap between BGA balls and PCB pads, safeguarding during reflow
✅ Lead-free and halogen-free formulation with minimal fumes and no corrosive residue
✅ High tackiness keeps solder balls nestled in the stencil during reballing
✅ Includes 10 g syringe and 1.6 mm tip for precise, controlled application
💡 What is low-viscosity halogen-free flux used for in BGA rework and reballing? Here's a handy quick answer. - It coats tiny gaps between BGA balls and PCB pads to prevent oxidation during high-temp steps. - It stays sticky to keep solder balls in the stencil during reballing and helps with stencil integrity. - It is lead-free and halogen-free, producing minimal fumes and easy cleanup with alcohol if needed.