Kapton Polyimide Film Tape 1 Mil Electrical Grade With Silicone Adhesive For Wave Solder And Hot Air Leveling Pro Grade Tape That Protects Gold Contacts On Printed Circuit Boards Amber Transparent Color Three Quarter Inch By Thirty Six Yards
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SKU: VXB004MSO2KA
Polyimide Film Tape for PCB Gold Contacts, 0.75in x 36yd Roll
✔️ 1 mil film, silicone adhesive, amber/transparent; 0.75in x 36yd roll
✅ Thickness total 2.6 mils (carrier+adhesive); carrier 1 mil
✅ Silicone adhesive, high-performance, thermosets for stronger adhesion; minimal residue
✅ Protects gold PCB contacts during wave soldering and hot air leveling
✅ Dielectric breakdown 6500 V; service temp 14°F to 392°F (−10°C to 200°C)
✅ UL510 flame retardant; MIL-P-46112B compliant; 3 in core; amber/transparent
✅ Observes board during processing; resistant to acids, oils, solvents, water
✔️ 1 mil film, silicone adhesive, amber/transparent; 0.75in x 36yd roll
This electrical-grade polyimide film tape is a masking/cover tape used to protect gold PCB contacts during wave soldering and hot air leveling. It is thin, conformable, and resists tearing at high temperatures, while leaving minimal residue for easier cleanup. Also handy for bicycle rims. Width: 0.75 in (19.05 mm); length: 36 yd (32.92 m). Core: 3 in.
✅ Width 0.75 in (19.05 mm); length 36 yd (32.92 m)✅ Thickness total 2.6 mils (carrier+adhesive); carrier 1 mil
✅ Silicone adhesive, high-performance, thermosets for stronger adhesion; minimal residue
✅ Protects gold PCB contacts during wave soldering and hot air leveling
✅ Dielectric breakdown 6500 V; service temp 14°F to 392°F (−10°C to 200°C)
✅ UL510 flame retardant; MIL-P-46112B compliant; 3 in core; amber/transparent
✅ Observes board during processing; resistant to acids, oils, solvents, water
💡 What is polyimide film tape used for in electronics manufacturing?
- Handy masking tape for protecting PCB gold contacts during soldering and reflow. - Provides high-temperature resistance and clean removal with minimal residue. - Works as a cost-effective masking option for heat-intensive processes. - Commonly used in PCB assembly and protective masking tasks during high-temp operations.
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