35g Sn63Pb37 Leaded Solder Paste for BGA Repair and SMT PCB Work, Pro Grade, 183 C Melting Point, Syringe Pack, Great for Cellphones, ICs, CPUs, LEDs, and Electronics Assembly, 2 Pack
Normalpreis
88,88 $
Aktionspreis150,00 $Sie sparen 61,12 $
Precision leaded solder paste for SMT and BGA repairs
✔️ 2-syringe pack, Sn63Pb37 leaded paste, 183°C melt for BGA/SMT
✅ Sn63Pb37 leaded alloy with 183°C melting point for controlled reflow
✅ Excellent wetting for bright, full joints on BGA/SMT boards
✅ Colorless residue that cleans easily and won't affect inspection
✅ Shelf-stable at room temp with good printability; length 102 mm (4.02 in)
✔️ 2-syringe pack, Sn63Pb37 leaded paste, 183°C melt for BGA/SMT
Professional-grade solder paste designed for high-precision electronics work, ideal for cellphone boards, SMT PCB assembly, and BGA rework.
✅ 35 g per syringe; 2-syringe pack for extended use✅ Sn63Pb37 leaded alloy with 183°C melting point for controlled reflow
✅ Excellent wetting for bright, full joints on BGA/SMT boards
✅ Colorless residue that cleans easily and won't affect inspection
✅ Shelf-stable at room temp with good printability; length 102 mm (4.02 in)
💡 What is solder paste used for in electronics assembly?
1. Holds components in place during the reflow process for SMT. 2. Enables precise printing and strong joint formation on fine-pitch parts like BGA. 3. Supports clean, inspection-friendly solder joints on ICs and LEDs.