100g No Clean Solder Flux Paste For BGA PCB Repair And Rework, High Viscosity Solder Paste For Sphere Or Pin Attachment To BGA CGA CSP Packages, Ideal For Rework, Reflow, And PCB Assembly
✔️ High-viscosity no-clean flux for BGA/CGA/CSP rework and attachment
The 100 g RMA-218 solder flux paste is a high-viscosity, no-clean formula ideal for BGA, CGA, and CSP sphere or pin attachment, reballing, rework, and flip-chip PCB assembly operations.
✅ 100 g container for convenient stock and single-use application
✅ High-viscosity formula keeps paste where you need it during reballing
✅ No-clean residue minimizes cleaning time in most workflows
✅ Pink color helps visibility during application
✅ Compatible with BGA, CGA, CSP, and flip-chip packaging
💡 What is this solder flux paste used for in BGA rework and PCB assembly? This handy flux supports secure attachment of balls or pins and improves solder wetting during reflow, aiding reliable reballing and chip attachment. - Helps with BGA/CGA/CSP ball attachment - Improves solder wetting on fine-pitch packages - Reduces cleaning effort after soldering - Works with lead-free and conventional solders