{"product_id":"pro-grade-magnetic-bga-reballing-stencil-kit-for-i","title":"Pro Grade Magnetic BGA Reballing Stencil Kit For IPhone A13 CPU Bottom Layer Solder Tin Planting Template Direct Heat Net Reballing Steel Mesh Repair Tools 010mm","description":"\u003cdiv\u003ePremium Magnetic BGA Reballing Kit for iPhone A13 - 1pc\u003cbr\u003e\n✔️ 0.10mm thickness, magnetic template, heat resistant steel \u003cp\u003eThis magnetic reballing stencil kit is designed for iPhone A13 CPU bottom-layer solder tin planting and direct-heat welding. It’s an essential tool for professional repair shops needing precise tin deposition during BGA reballing.\u003c\/p\u003e ✅ 0.10mm stencil thickness for precise tin planting on iPhone A13 CPU pads \u003cbr\u003e\n✅ Magnetic template for quick alignment during reballing \u003cbr\u003e\n✅ Heat-resistant steel mesh withstands direct heat soldering \u003cbr\u003e\n✅ All steel materials are made in Japan for durability \u003cbr\u003e\n✅ Pack: 1 piece \u003cbr\u003e \u003cp\u003e💡 What is a BGA reballing stencil kit used for in iPhone repair?\u003cbr\u003eA handy explanation: It guides tin deposition on the CPU bottom-layer pads during reballing for reliable solder joints.\u003cbr\u003e- BGA reballing stencil guides solder ball placement on iPhone A13 CPU pads\u003cbr\u003e- 0.10mm stencil thickness enables precise tin deposition with direct heat\u003cbr\u003e- Magnetic template helps quick alignment during repair work\u003c\/p\u003e✝️\u003c\/div\u003e","brand":"Amazon","offers":[{"title":"Default Title","offer_id":49041645699307,"sku":"VXB09TGVWCF8","price":52.95,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/3268\/0683\/files\/71hVUFcnZ8L.jpg?v=1783817480","url":"https:\/\/vxb.com\/products\/pro-grade-magnetic-bga-reballing-stencil-kit-for-i","provider":"VXB Bearings","version":"1.0","type":"link"}