{"product_id":"universal-bga-reballing-solder-paste-stencil-kit-f","title":"Universal BGA Reballing Solder Paste Stencil Kit For Phone IC Repair, Stainless Steel Mesh Template With Multi Size Holes 0.3, 0.35, 0.4, 0.5 Pitch, Different Spacings, Soldering Station Compatible","description":"\u003cdiv\u003eBGA Reballing Solder Stencil Kit for Phone IC Repair\u003cbr\u003e\n✔️ Stainless steel mesh stencil with 0.3\/0.35\/0.4\/0.5 pitch holes \u003cp\u003eThis universal BGA reballing stencil is designed for precise tin deposition on ball-grid arrays used in modern smartphones, enabling reliable reballing for IC repair. It’s a handy tool for service centers and hobbyists working with mobile devices.\u003c\/p\u003e ✅ Multi-size holes: 0.3\/0.35\/0.4\/0.5 pitch and multiple spacings\u003cbr\u003e\n✅ Premium stainless steel mesh for durability and precise tin deposition\u003cbr\u003e\n✅ Precise positioning maintains ball shape under high temperatures\u003cbr\u003e\n✅ Compact, portable stencil for easy transport in a repair kit\u003cbr\u003e \u003cp\u003e💡 What is a BGA reballing stencil used for in phone IC repair?\u003c\/p\u003e\n\u003cp\u003eA handy tool for technicians doing BGA reballing on mobile ICs. It helps ensure precise tin deposition and reliable rework outcomes.\u003c\/p\u003e\n- precise hole patterns for 0.3-0.5 mm pitches\n- consistent tin transfer with stable ball geometry\n- reduces solder bridging and misalignment during reflow\n- works with common solder pastes and rework stations\u003c\/div\u003e","brand":"Amazon","offers":[{"title":"Default Title","offer_id":48171334729963,"sku":"VXB0BRCS4FLP","price":49.98,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/3268\/0683\/files\/61T8ZS3yiXL.jpg?v=1778100496","url":"https:\/\/vxb.com\/products\/universal-bga-reballing-solder-paste-stencil-kit-f","provider":"VXB Bearings","version":"1.0","type":"link"}