{"product_id":"100g-rma-218-no-clean-solder-flux-paste-for-bga-pc","title":"100g RMA 218 No Clean Solder Flux Paste For BGA PCB Repair Rework Soldering High Viscosity Solder Flux For Sphere Or Pin Attachments On CGA CSP Packages","description":"\u003cdiv\u003eHigh-Viscosity No-Clean Flux Paste for BGA Rework 100g\u003cbr\u003e\n✔️ 1 x 100 g no-clean flux paste for BGA\/CGA\/CSP rework \u003cp\u003eThis high-viscosity no-clean flux paste is designed for BGA rework, sphere or pin attachments on BGA, CGA, and CSP packages. It's ideal for reballing and flip-chip operations, enabling secure solder ball adhesion with minimal cleanup.\u003c\/p\u003e ✅ High-viscosity formula provides strong tack during sphere and pin attachment \u003cbr\u003e\n✅ No-clean flux leaves minimal residues suitable for BGA\/CGA\/CSP boards \u003cbr\u003e\n✅ 100 g container enables precise, controlled application \u003cbr\u003e\n✅ Ideal for reballing and flip-chip assembly on common package types \u003cbr\u003e \u003cp\u003e💡 What is no-clean solder flux paste used for in BGA rework and why choose a high-viscosity formula?\u003c\/p\u003e\n\u003cp\u003eHere's a handy, concise explanation for common questions about this product category.\u003c\/p\u003e\n- No-clean flux reduces post-solder cleanup because residues are designed to be non-corrosive.\n- High viscosity helps hold tiny solder balls in place during placement and reflow.\n- It's handy for reballing, sphere or pin attachments on BGA, CGA, and CSP packages.\n- Works well with precision tools and minimizes bridging in dense PCB layouts. \u003c\/div\u003e","brand":"Amazon","offers":[{"title":"Default Title","offer_id":48171373232363,"sku":"VXB014RBDSIS","price":88.88,"currency_code":"USD","in_stock":true}],"url":"https:\/\/vxb.com\/products\/100g-rma-218-no-clean-solder-flux-paste-for-bga-pc","provider":"VXB Bearings","version":"1.0","type":"link"}